These and other innovations are reflected in more than 100 new patent filings worldwide related to Lepton technologies, processes, and applications. Lepton utilizes multiple proprietary technologies, including wafer level detector packaging, wafer level micro-optics, and a custom integrated circuit that supports all camera functions on a single integrated low power chip. OEMs around the world can benefit from the fully-exportable Lepton core, which generates high-quality, fully-processed thermal images through common standard interfaces. Lepton has also been designed for easy integration into third party products, such as smartphones, tablets, diagnostic tools, automobiles, toys, building controls, process equipment, security systems, machine vision systems, and advanced gaming devices. The first commercial use of Lepton is in the new FLIR ONE TM thermal imaging smartphone accessory introduced today at CES 2014. FLIR will utilize Lepton in new and existing products across many vertical markets.
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Similar in size, weight, and power consumption to a conventional CMOS cell phone camera module, Lepton is the world’s smallest microbolometer-based thermal imaging camera core currently available. Lepton utilizes innovative technology, high volume manufacturing techniques, and commercial scale to deliver a price point that is an order of magnitude below current thermal camera cores. has announced the release of the new FLIR Lepton thermal imaging camera core.